DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Jang, Changheui | - |
dc.contributor.advisor | 장창희 | - |
dc.contributor.author | An, Taejeong | - |
dc.date.accessioned | 2023-06-26T19:33:23Z | - |
dc.date.available | 2023-06-26T19:33:23Z | - |
dc.date.issued | 2022 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=1008317&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/309786 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 원자력및양자공학과, 2022.8,[iv, 52 p. :] | - |
dc.description.abstract | A research was conducted on diffusion bonding which is key process required for manufacturing a printed circuit heat exchanger. In this study, diffusion-bonded alloy 800H with Ni foil interlayer was used, and the tensile and stress-rupture test were conducted after post-bond heat treatment. In the case of tensile properties, the grain boundary migration was promoted when post-heat treatment was applied. Thus, the elongation was improved at 650°C. Regarding stress-rupture test, rupture time is decreased when applying PBHT-A condition (1100 ℃, 10 h), and increased when applying PBHT-B condition (1200 ℃, 1 h). It is considered by the distribution of Ti-rich carbide of the joint. Changes in the mechanical properties were discussed through microstructure analyses. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | Alloy 800H▼aDiffusion bonding▼aNi interlayer▼aPost-bond heat treatment▼aGrain boundary migration▼aTi-rich carbides | - |
dc.subject | 합금 800H▼a확산접합▼aNi 중간삽입물▼a후열처리▼a결정립계 이동▼aTi 탄화물 | - |
dc.title | Effect of post-bond heat treatment on the diffusion bonding properties of alloy 800H with Ni-foil interlayer | - |
dc.title.alternative | Ni 중간삽입물이 포함된 800H의 확산접합부 특성에 미치는 후열처리 영향 | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :원자력및양자공학과, | - |
dc.contributor.alternativeauthor | 안태정 | - |
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