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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of Cooling Rate on IMC and Mechanical Properties of Sn-Ag-Cu/Cu Pad

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dc.contributor.authorJeong, Sang Wonko
dc.contributor.authorLee, Hyuck-Moko
dc.contributor.authorKim, Jong-Hoonko
dc.date.accessioned2023-06-15T01:00:37Z-
dc.date.available2023-06-15T01:00:37Z-
dc.date.created2023-05-23-
dc.date.issued2004-03-
dc.identifier.citation133rd TMS Annual Meeting-
dc.identifier.urihttp://hdl.handle.net/10203/307302-
dc.languageEnglish-
dc.publisher133rd TMS Annual Meeting-
dc.titleEffect of Cooling Rate on IMC and Mechanical Properties of Sn-Ag-Cu/Cu Pad-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname133rd TMS Annual Meeting-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationCharlotte-
dc.contributor.localauthorLee, Hyuck-Mo-
dc.contributor.nonIdAuthorJeong, Sang Won-
dc.contributor.nonIdAuthorKim, Jong-Hoon-
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MS-Conference Papers(학술회의논문)
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