DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nah, Jae-Woong | ko |
dc.contributor.author | Kim, Jong Hoon | ko |
dc.contributor.author | Lee, Hyuck-Mo | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2023-06-15T01:00:32Z | - |
dc.date.available | 2023-06-15T01:00:32Z | - |
dc.date.created | 2023-05-23 | - |
dc.date.issued | 2004-03 | - |
dc.identifier.citation | 133rd TMS Annual Meeting | - |
dc.identifier.uri | http://hdl.handle.net/10203/307301 | - |
dc.language | English | - |
dc.publisher | 133rd TMS Annual Meeting | - |
dc.title | Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 133rd TMS Annual Meeting | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Charlotte | - |
dc.contributor.localauthor | Lee, Hyuck-Mo | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Nah, Jae-Woong | - |
dc.contributor.nonIdAuthor | Kim, Jong Hoon | - |
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