DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Seonghi | ko |
dc.contributor.author | Kim, Hyun Woong | ko |
dc.contributor.author | Park, Dongryul | ko |
dc.contributor.author | Ahn, Jangyong | ko |
dc.contributor.author | Ryu, Seunghun | ko |
dc.contributor.author | Park, Gagyeong | ko |
dc.contributor.author | Ahn, Seungyoung | ko |
dc.date.accessioned | 2023-02-07T07:00:31Z | - |
dc.date.available | 2023-02-07T07:00:31Z | - |
dc.date.created | 2023-02-02 | - |
dc.date.created | 2023-02-02 | - |
dc.date.created | 2023-02-02 | - |
dc.date.created | 2023-02-02 | - |
dc.date.issued | 2022-12-13 | - |
dc.identifier.citation | 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022 | - |
dc.identifier.issn | 2151-1225 | - |
dc.identifier.uri | http://hdl.handle.net/10203/305072 | - |
dc.description.abstract | In this paper, we propose a deep reinforcement learning (DRL)-based multi-power distribution network (PDN) decoupling capacitor design optimization method considering transfer noise in 3D-ICs. The transfer noise from multi-PDN with vertical structures could cause system failure, the entire simultaneous switching noise (SSN) with the combined transfer noise should be considered. To address the multi-PDN problem, we use reinforcement learning suitable for solving complex optimization problems. The input dataset and Markov decision process (MDP) were designed to optimize various multi-PDN cases. The 5x4 size of two PDNs with a vertically stacked structure was used for verification. The proposed method successfully optimizes the decoupling capacitors of multi-PDN. In addition, the proposed method was compared to genetic algorithm (GA), the proposed method perfomed better optimization and reduced the time by about 99% compared to GA to 0.08 seconds. | - |
dc.language | English | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs | - |
dc.type | Conference | - |
dc.identifier.wosid | 000927225900012 | - |
dc.identifier.scopusid | 2-s2.0-85146151664 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Urbana | - |
dc.identifier.doi | 10.1109/EDAPS56906.2022.9994990 | - |
dc.contributor.localauthor | Ahn, Seungyoung | - |
dc.contributor.nonIdAuthor | Park, Gagyeong | - |
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