Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs

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dc.contributor.authorLee, Seonghiko
dc.contributor.authorKim, Hyun Woongko
dc.contributor.authorPark, Dongryulko
dc.contributor.authorAhn, Jangyongko
dc.contributor.authorRyu, Seunghunko
dc.contributor.authorPark, Gagyeongko
dc.contributor.authorAhn, Seungyoungko
dc.date.accessioned2023-02-07T07:00:31Z-
dc.date.available2023-02-07T07:00:31Z-
dc.date.created2023-02-02-
dc.date.created2023-02-02-
dc.date.created2023-02-02-
dc.date.created2023-02-02-
dc.date.issued2022-12-13-
dc.identifier.citation2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022-
dc.identifier.issn2151-1225-
dc.identifier.urihttp://hdl.handle.net/10203/305072-
dc.description.abstractIn this paper, we propose a deep reinforcement learning (DRL)-based multi-power distribution network (PDN) decoupling capacitor design optimization method considering transfer noise in 3D-ICs. The transfer noise from multi-PDN with vertical structures could cause system failure, the entire simultaneous switching noise (SSN) with the combined transfer noise should be considered. To address the multi-PDN problem, we use reinforcement learning suitable for solving complex optimization problems. The input dataset and Markov decision process (MDP) were designed to optimize various multi-PDN cases. The 5x4 size of two PDNs with a vertically stacked structure was used for verification. The proposed method successfully optimizes the decoupling capacitors of multi-PDN. In addition, the proposed method was compared to genetic algorithm (GA), the proposed method perfomed better optimization and reduced the time by about 99% compared to GA to 0.08 seconds.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleDeep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs-
dc.typeConference-
dc.identifier.wosid000927225900012-
dc.identifier.scopusid2-s2.0-85146151664-
dc.type.rimsCONF-
dc.citation.publicationname2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationUrbana-
dc.identifier.doi10.1109/EDAPS56906.2022.9994990-
dc.contributor.localauthorAhn, Seungyoung-
dc.contributor.nonIdAuthorPark, Gagyeong-
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