Signal Integrity Analysis of High Speed Channel considering Thermal Distribution

Abstract

In this paper, we analyzed a high speed PCB channel and silicon interposer channel considering thermal distribution. High temperature degrades the signal integrity (SI) performances of channel. Therefore, temperature-dependent SI analysis is essential for channel layout design. However, the previous temperature-dependent SI analysis is focused on constant temperature, while it gives less attention to thermal distributions. Hence, this research analyzed thermal distributions with various mean temperatures and standard deviations effect to insertion loss of channel. By using electromagnetic (EM) simulation, we analyzed the thermal distribution effects on high speed channel SI performances. Temperature-dependent SI analysis showed the thermal distribution contributes to critical SI issues for high speed channels. As a result, it showed the increasing mean temperature of thermal distribution caused SI performance degradation.