DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, SeongGuk | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Shin, TaeIn | ko |
dc.contributor.author | Park, Hyunwook | ko |
dc.contributor.author | Lho, Daehwan | ko |
dc.contributor.author | Son, Keeyoung | ko |
dc.contributor.author | Kim, Keunwoo | ko |
dc.contributor.author | Park, Joonsang | ko |
dc.contributor.author | Choi, Seonguk | ko |
dc.contributor.author | Kim, Haeyeon | ko |
dc.date.accessioned | 2023-02-02T01:00:37Z | - |
dc.date.available | 2023-02-02T01:00:37Z | - |
dc.date.created | 2023-01-25 | - |
dc.date.issued | 2021-12-13 | - |
dc.identifier.citation | IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 | - |
dc.identifier.issn | 2151-1225 | - |
dc.identifier.uri | http://hdl.handle.net/10203/304938 | - |
dc.description.abstract | In this paper, we proposed the design of a spiral through-silicon via (TSV) array channel for high bandwidth memory (HBM) with 8 Gbps data transmission. In 12-stacked HBM, we design the spiral TSV array including the physical structure and pin assignment to reduce channel loss and via-to-via crosstalk. To verify the proposed channel, the channel model is extracted by a high-frequency structure simulator (HFSS). The electrical performance is simulated and analyzed in the frequency and time domains. As a result, the proposed design successfully improves eye height and width at 8 Gbps compared to the conventional spiral TSV array. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-85124170738 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Urbana | - |
dc.identifier.doi | 10.1109/EDAPS53774.2021.9657033 | - |
dc.contributor.localauthor | Kim, Joungho | - |
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