Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Keunwoo | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Lee, Junghyun | ko |
| dc.contributor.author | Hong, Seokwoo | ko |
| dc.contributor.author | Sim, BooGyo | ko |
| dc.contributor.author | Son, Kyungjune | ko |
| dc.contributor.author | Shin, TaeIn | ko |
| dc.contributor.author | Son, Keeyoung | ko |
| dc.date.accessioned | 2023-01-31T03:01:51Z | - |
| dc.date.available | 2023-01-31T03:01:51Z | - |
| dc.date.created | 2023-01-25 | - |
| dc.date.issued | 2022-10-12 | - |
| dc.identifier.citation | 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/304820 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Marriott, San Jose | - |
| dc.contributor.localauthor | Kim, Joungho | - |
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