Bildsensormodul und Verfahren zu seiner Herstellung

Abstract

An image sensor module is provided to minimize the thickness of an image sensor module by using glass coated with an IR filter as a substrate such that the glass has the same size as an image sensor chip. A non-solder bump is formed at each input/output terminal. A partition wall of a lattice structure is formed on an image sensing surface of an image sensor chip except an image sensing region is electrically connected to a glass substrate having an IR (infrared ray) coating layer and a metal electrode by a flip chip bonding process while a chip sealing process is performed. After a metal interconnection is redistributed to the lower surface of the glass substrate, a solder and a non-solder bump are formed.