BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH, METHOD OF MANUFACTURING THE SAME AND WEARABLE DEVICE INCLUDING THE SAME생체 모방형 고신축성 전도성 건식 접착 패치, 이의 제조 방법 및 이를 포함하는 웨어러블 기기

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 247
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorJeon, Seokwooko
dc.contributor.authorKim, Tae-Hoonko
dc.contributor.authorCho, Dong-hwiko
dc.contributor.authorPark, Junyongko
dc.date.accessioned2022-12-22T06:02:14Z-
dc.date.available2022-12-22T06:02:14Z-
dc.identifier.urihttp://hdl.handle.net/10203/303530-
dc.description.abstractIn a method of manufacturing a biomimetic highly stretchable conductive dry adhesive patch, a mold including a plurality of holes is provided by etching a semiconductor substrate including an insulation layer based on a footing effect. A conductive polymer composite is provided by dispersing mixed conductive fillers in a liquid elastomer. The mixed conductive fillers are formed by mixing one-dimensional conductive fillers and two-dimensional conductive fillers. The conductive polymer composite is applied on the mold such that the conductive polymer composite is injected into the plurality of holes. A conductive dry adhesive structure including a plurality of micropillars corresponding to the plurality of holes is obtained by performing a post-treatment on the conductive polymer composite applied on the mold and by removing the mold. Each of the plurality of micropillars includes a body portion and a tip portion. The tip portion has a spatula shape, is formed on the body portion, and has an area larger than that of the body portion in a plan view.-
dc.titleBIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH, METHOD OF MANUFACTURING THE SAME AND WEARABLE DEVICE INCLUDING THE SAME-
dc.title.alternative생체 모방형 고신축성 전도성 건식 접착 패치, 이의 제조 방법 및 이를 포함하는 웨어러블 기기-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthorJeon, Seokwoo-
dc.contributor.nonIdAuthorKim, Tae-Hoon-
dc.contributor.nonIdAuthorCho, Dong-hwi-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber16486245-
dc.identifier.patentRegistrationNumber11490859-
dc.date.application2018-02-05-
dc.date.registration2022-11-08-
dc.publisher.countryUS-
Appears in Collection
MS-Patent(특허)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0