DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeon, Seokwoo | ko |
dc.contributor.author | Kim, Tae-Hoon | ko |
dc.contributor.author | Cho, Dong-hwi | ko |
dc.contributor.author | Park, Junyong | ko |
dc.date.accessioned | 2022-12-22T06:02:14Z | - |
dc.date.available | 2022-12-22T06:02:14Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/303530 | - |
dc.description.abstract | In a method of manufacturing a biomimetic highly stretchable conductive dry adhesive patch, a mold including a plurality of holes is provided by etching a semiconductor substrate including an insulation layer based on a footing effect. A conductive polymer composite is provided by dispersing mixed conductive fillers in a liquid elastomer. The mixed conductive fillers are formed by mixing one-dimensional conductive fillers and two-dimensional conductive fillers. The conductive polymer composite is applied on the mold such that the conductive polymer composite is injected into the plurality of holes. A conductive dry adhesive structure including a plurality of micropillars corresponding to the plurality of holes is obtained by performing a post-treatment on the conductive polymer composite applied on the mold and by removing the mold. Each of the plurality of micropillars includes a body portion and a tip portion. The tip portion has a spatula shape, is formed on the body portion, and has an area larger than that of the body portion in a plan view. | - |
dc.title | BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH, METHOD OF MANUFACTURING THE SAME AND WEARABLE DEVICE INCLUDING THE SAME | - |
dc.title.alternative | 생체 모방형 고신축성 전도성 건식 접착 패치, 이의 제조 방법 및 이를 포함하는 웨어러블 기기 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Jeon, Seokwoo | - |
dc.contributor.nonIdAuthor | Kim, Tae-Hoon | - |
dc.contributor.nonIdAuthor | Cho, Dong-hwi | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 16486245 | - |
dc.identifier.patentRegistrationNumber | 11490859 | - |
dc.date.application | 2018-02-05 | - |
dc.date.registration | 2022-11-08 | - |
dc.publisher.country | US | - |
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