Method and device used for manufacturing microchannel surface plate using wave shaped mould

Abstract

Disclosed is a method and apparatus for producing a microchannel plate (MCP) using a corrugated mold, characterized in that each of corrugated substrates formed by the corrugated mold is coated with a secondary emitter and then layered, thereby easily producing a large area of the MCP and decreasing production costs of the MCP. The MCP producing method includes placing a first flat substrate on the corrugated mold, vacuum forming the first flat substrate so that both surfaces thereof are corrugated, coating a secondary emitter onto both surfaces of each of the first corrugated substrate and a second flat substrate, and alternately layering a plurality of the first corrugated substrates and a plurality of the second substrates each coated with the secondary emitter, to form microchannels.