Method for manufacturing conductive adhesive for high frequency flip chip package applications고주파 플립 칩 패키지 애플리케이션을 위한 전도성 접착제 제조 방법

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorYim, Myung jinko
dc.contributor.authorKwon, Woon Seongko
dc.date.accessioned2022-12-16T07:02:19Z-
dc.date.available2022-12-16T07:02:19Z-
dc.identifier.urihttp://hdl.handle.net/10203/303128-
dc.description.abstractDisclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.-
dc.titleMethod for manufacturing conductive adhesive for high frequency flip chip package applications-
dc.title.alternative고주파 플립 칩 패키지 애플리케이션을 위한 전도성 접착제 제조 방법-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorYim, Myung jin-
dc.contributor.nonIdAuthorKwon, Woon Seong-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber10068878-
dc.identifier.patentRegistrationNumber06514560-
dc.date.application2002-02-11-
dc.date.registration2003-02-04-
dc.publisher.countryUS-
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MS-Patent(특허)
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