DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Yim, Myung jin | ko |
dc.contributor.author | Kwon, Woon Seong | ko |
dc.date.accessioned | 2022-12-16T07:02:19Z | - |
dc.date.available | 2022-12-16T07:02:19Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/303128 | - |
dc.description.abstract | Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave. | - |
dc.title | Method for manufacturing conductive adhesive for high frequency flip chip package applications | - |
dc.title.alternative | 고주파 플립 칩 패키지 애플리케이션을 위한 전도성 접착제 제조 방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Yim, Myung jin | - |
dc.contributor.nonIdAuthor | Kwon, Woon Seong | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 10068878 | - |
dc.identifier.patentRegistrationNumber | 06514560 | - |
dc.date.application | 2002-02-11 | - |
dc.date.registration | 2003-02-04 | - |
dc.publisher.country | US | - |
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