A method for producing an electrode of Ni/metal hydride alloy secondary cells. The electrode may be produced by mixing an active material with approximately 10-50 wt % of Cu powders, which can serve as a binder as well as a current collector, and cold-pressing the mixture at a pressure of 10 ton/cm. As the Cu-compacted electrode continues to experience the cycle of charge and discharge, the desolution-deposition of Cu is gradually produced. This desolution-deposition of Cu allows Cu to be deposited on the surface of the electrode comprising the hydrogen storage alloy, so that the electrode can be similar to a conventional Cu-electroless plated electrode in surface morphology. Consequently, the method of the invention can be an alternative for conventional electroless plating, which significantly improves the general functions of hydrogen storage alloy electrode, including low temperature dischargeability and high rate capability, without producing pollution of the environment.