DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Seong Kwang | ko |
dc.contributor.author | Lim, Hyeong-Rak | ko |
dc.contributor.author | Jeong, Jaejoong | ko |
dc.contributor.author | Lee, Seung Woo | ko |
dc.contributor.author | Kim, Joon Pyo | ko |
dc.contributor.author | Jeong, Jaeyoung | ko |
dc.contributor.author | Kim, Bong Ho | ko |
dc.contributor.author | Geum, Dae-Myoung | ko |
dc.contributor.author | Kim, Younghyun | ko |
dc.contributor.author | Baek, Yongku | ko |
dc.contributor.author | Cho, Byung-Jin | ko |
dc.contributor.author | Kim, Sanghyeon | ko |
dc.date.accessioned | 2022-11-24T23:00:12Z | - |
dc.date.available | 2022-11-24T23:00:12Z | - |
dc.date.created | 2022-11-18 | - |
dc.date.created | 2022-11-18 | - |
dc.date.issued | 2022-12-03 | - |
dc.identifier.citation | 68th IEEE International Electron Devices Meeting, IEDM 2022 | - |
dc.identifier.uri | http://hdl.handle.net/10203/300923 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Hybrid 3D Sequential CFET with Ge (110) Nanosheet p-FET on Si (100) bulk n-FET by Direct Wafer Bonding | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 68th IEEE International Electron Devices Meeting, IEDM 2022 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Hilton San Francisco Union Square | - |
dc.contributor.localauthor | Cho, Byung-Jin | - |
dc.contributor.localauthor | Kim, Sanghyeon | - |
dc.contributor.nonIdAuthor | Kim, Seong Kwang | - |
dc.contributor.nonIdAuthor | Lim, Hyeong-Rak | - |
dc.contributor.nonIdAuthor | Jeong, Jaejoong | - |
dc.contributor.nonIdAuthor | Lee, Seung Woo | - |
dc.contributor.nonIdAuthor | Kim, Joon Pyo | - |
dc.contributor.nonIdAuthor | Jeong, Jaeyoung | - |
dc.contributor.nonIdAuthor | Kim, Bong Ho | - |
dc.contributor.nonIdAuthor | Geum, Dae-Myoung | - |
dc.contributor.nonIdAuthor | Kim, Younghyun | - |
dc.contributor.nonIdAuthor | Baek, Yongku | - |
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