Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

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dc.contributor.authorLee, Wonbeomko
dc.contributor.authorKim, Hyunjunko
dc.contributor.authorKang, Inhoko
dc.contributor.authorPark, Hongjunko
dc.contributor.authorJung, Jiyoungko
dc.contributor.authorLee, Hae-Seungko
dc.contributor.authorPark, Hyunchangko
dc.contributor.authorPark, Jisuko
dc.contributor.authorYuk, Jong Minko
dc.contributor.authorRyu, Seunghwako
dc.contributor.authorJeong, Jae-Woongko
dc.contributor.authorKang, Jiheongko
dc.date.accessioned2022-11-19T02:00:24Z-
dc.date.available2022-11-19T02:00:24Z-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.created2022-11-19-
dc.date.issued2022-11-
dc.identifier.citationSCIENCE, v.378, no.6620, pp.637 - 641-
dc.identifier.issn0036-8075-
dc.identifier.urihttp://hdl.handle.net/10203/300120-
dc.description.abstractAn elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMPNet) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMPNet conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMPNet in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics.-
dc.languageEnglish-
dc.publisherAmerican Association for the Advancement of Science-
dc.titleUniversal assembly of liquid metal particles in polymers enables elastic printed circuit board-
dc.typeArticle-
dc.identifier.wosid000898883700010-
dc.identifier.scopusid2-s2.0-85141557666-
dc.type.rimsART-
dc.citation.volume378-
dc.citation.issue6620-
dc.citation.beginningpage637-
dc.citation.endingpage641-
dc.citation.publicationnameSCIENCE-
dc.identifier.doi10.1126/science.abo6631-
dc.contributor.localauthorYuk, Jong Min-
dc.contributor.localauthorRyu, Seunghwa-
dc.contributor.localauthorJeong, Jae-Woong-
dc.contributor.localauthorKang, Jiheong-
dc.contributor.nonIdAuthorPark, Hongjun-
dc.contributor.nonIdAuthorPark, Hyunchang-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordPlusSILVER NANOPARTICLES-
dc.subject.keywordPlusSOFT-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusCONDUCTORS-
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