DC Field | Value | Language |
---|---|---|
dc.contributor.author | Rongione, Nicolas Augustus | ko |
dc.contributor.author | Li, Man | ko |
dc.contributor.author | Wu, Huan | ko |
dc.contributor.author | Huu Duy Nguyen | ko |
dc.contributor.author | Kang, Joon Sang | ko |
dc.contributor.author | Ouyang, Boya | ko |
dc.contributor.author | Xia, Hongyan | ko |
dc.contributor.author | Hu, Yongjie | ko |
dc.date.accessioned | 2022-08-02T09:00:57Z | - |
dc.date.available | 2022-08-02T09:00:57Z | - |
dc.date.created | 2022-08-02 | - |
dc.date.issued | 2019-03 | - |
dc.identifier.citation | ADVANCED ELECTRONIC MATERIALS, v.5, no.3 | - |
dc.identifier.issn | 2199-160X | - |
dc.identifier.uri | http://hdl.handle.net/10203/297693 | - |
dc.description.abstract | Lower grade waste heat recovery near room temperature is limited due to multiple technology challenges including low efficiency, high cost, and scalability. Here, a low-cost and scalable solution process is reported to fabricate a nanostructured SnSe thin film, and a high thermoelectric performance near room temperature is demonstrated. This transport study reveals strong phonon scattering near the interfaces between SnSe nanosheets that introduces a large thermal boundary resistance and an ultralow thermal conductivity of 0.09 W m(-1) K-1. Moreover, it is demonstrated that the SnSe thin film can be readily implemented on flexible plastic substrates and preserve the high thermoelectric performance over 1000 bending cycles. Together, this study demonstrates a low-cost and scalable approach to achieve high-performance flexible thin film energy harvesting devices to power electronics and sensors near room temperature. | - |
dc.language | English | - |
dc.publisher | WILEY | - |
dc.title | High-Performance Solution-Processable Flexible SnSe Nanosheet Films for Lower Grade Waste Heat Recovery | - |
dc.type | Article | - |
dc.identifier.wosid | 000461544600019 | - |
dc.identifier.scopusid | 2-s2.0-85061088600 | - |
dc.type.rims | ART | - |
dc.citation.volume | 5 | - |
dc.citation.issue | 3 | - |
dc.citation.publicationname | ADVANCED ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1002/aelm.201800774 | - |
dc.contributor.localauthor | Kang, Joon Sang | - |
dc.contributor.nonIdAuthor | Rongione, Nicolas Augustus | - |
dc.contributor.nonIdAuthor | Li, Man | - |
dc.contributor.nonIdAuthor | Wu, Huan | - |
dc.contributor.nonIdAuthor | Huu Duy Nguyen | - |
dc.contributor.nonIdAuthor | Ouyang, Boya | - |
dc.contributor.nonIdAuthor | Xia, Hongyan | - |
dc.contributor.nonIdAuthor | Hu, Yongjie | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | 2D van der Waals materials | - |
dc.subject.keywordAuthor | energy efficiency | - |
dc.subject.keywordAuthor | flexible electronics | - |
dc.subject.keywordAuthor | nanostructures | - |
dc.subject.keywordAuthor | phonons | - |
dc.subject.keywordAuthor | solution-processing | - |
dc.subject.keywordAuthor | thermal energy harvesting | - |
dc.subject.keywordAuthor | thermoelectrics | - |
dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | THERMOELECTRIC-MATERIALS | - |
dc.subject.keywordPlus | FIGURE | - |
dc.subject.keywordPlus | MERIT | - |
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