DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Kim, Joungho | - |
dc.contributor.advisor | 김정호 | - |
dc.contributor.author | Son, Keeyoung | - |
dc.date.accessioned | 2022-04-27T19:31:01Z | - |
dc.date.available | 2022-04-27T19:31:01Z | - |
dc.date.issued | 2021 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=948715&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/295948 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 전기및전자공학부, 2021.2,[iii, 46 p. :] | - |
dc.description.abstract | In this paper, we firstly proposed a thermal transmission line and fluidic through silicon via based embedded cooling structure for next-generation high bandwidth memory module considering signal and thermal integrity. This paper aims to design the embedded cooling structure to secure both signal and thermal integrity performances. For this, we design and analyze the thermal transmission line and fluidic through silicon via considering signal and thermal integrity. In order to verify the proposed embedded cooling structure, we compared the thermal integrity performance and temperature-dependent signal integrity performances between the proposed embedded cooling structure and the previous structure. The proposed embedded cooling structure can cool down the high bandwidth memory module, and also prevents heat accumulation inside each DRAM dies. Finally, it is confirmed that the signal integrity performances considering the operating temperature is improved compared to the previous cooling structure. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | Embedded Cooling Structure▼aFluidic Through Silicon Via▼aHigh Bandwidth Memory Module▼aSignal Integrity▼aThermal integrity▼aThermal Transmission Line | - |
dc.subject | 고대역폭 메모리 모듈▼a내장형 냉각 구조▼a신호 무결성▼a열 무결성▼a열 전송 선로▼a유체 흐름용 실리콘 관통 비아 | - |
dc.title | Thermal transmission line (TTL) and fluidic through silicon via (F-TSV) based embedded cooling structure for high bandwidth memory (HBM) module considering signal and thermal integrity (STI) | - |
dc.title.alternative | 신호 무결성 및 열 무결성을 고려한 고대역폭 메모리 모듈을 위한 열 전송 선로와 유체 흐름용 실리콘 관통 비아 기반 내장형 냉각 구조 설계 | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :전기및전자공학부, | - |
dc.contributor.alternativeauthor | 손기영 | - |
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