A Highly Bendable Thin Film Encapsulation with Thermal Residual Stress Optimization
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박용천 | ko |
| dc.contributor.author | 임성갑 | ko |
| dc.date.accessioned | 2021-11-18T06:43:10Z | - |
| dc.date.available | 2021-11-18T06:43:10Z | - |
| dc.date.created | 2021-11-16 | - |
| dc.date.issued | 2021-05-20 | - |
| dc.identifier.citation | 48th World Polymer Congress IUPAC-MACRO 2020+ | - |
| dc.identifier.uri | http://hdl.handle.net/10203/289268 | - |
| dc.language | English | - |
| dc.publisher | 한국고분자학회 | - |
| dc.title | A Highly Bendable Thin Film Encapsulation with Thermal Residual Stress Optimization | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 48th World Polymer Congress IUPAC-MACRO 2020+ | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Virtual | - |
| dc.contributor.localauthor | 임성갑 | - |
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