QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물

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dc.contributor.author이해신ko
dc.contributor.author왕윤선ko
dc.contributor.author황홍구ko
dc.contributor.author한정석ko
dc.date.accessioned2021-11-16T06:43:44Z-
dc.date.available2021-11-16T06:43:44Z-
dc.identifier.urihttp://hdl.handle.net/10203/289168-
dc.description.abstractThe present invention relates to a curable composition and use thereof, and more particularly, to a curable composition and use thereof, the curable composition comprising: (a) a compound capable of changing to a quinone compound by oxygen; (b) an amine-based polymer; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at the interface of a conventional film but also inside the film, and thus, the curable composition has uniform physical properties and excellent physical properties throughout the film, as compared to a cured film cured at an existing interface.-
dc.titleQUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME-
dc.title.alternative퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor이해신-
dc.contributor.nonIdAuthor왕윤선-
dc.contributor.nonIdAuthor황홍구-
dc.contributor.nonIdAuthor한정석-
dc.contributor.assigneeKAIST, KOLON INDUSTRIES INC-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber201780068202.1-
dc.identifier.patentRegistrationNumber109906248-
dc.date.application2017-09-27-
dc.date.registration2021-10-15-
dc.publisher.countryCC-
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CH-Patent(특허)
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