Sensitivity-Controllable Liquid-Metal-Based Pressure Sensor for Wearable Applications

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dc.contributor.authorGul, Osmanko
dc.contributor.authorKim, Kyuyoungko
dc.contributor.authorGu, Jiminko
dc.contributor.authorChoi, Jungrakko
dc.contributor.authorHenriquez, Dionisio Del Orbeko
dc.contributor.authorAhn, Junseongko
dc.contributor.authorPark, Inkyuko
dc.date.accessioned2021-10-18T08:10:40Z-
dc.date.available2021-10-18T08:10:40Z-
dc.date.created2021-10-18-
dc.date.created2021-10-18-
dc.date.created2021-10-18-
dc.date.created2021-10-18-
dc.date.created2021-10-18-
dc.date.created2021-10-18-
dc.date.issued2021-09-
dc.identifier.citationACS APPLIED ELECTRONIC MATERIALS, v.3, no.9, pp.4027 - 4036-
dc.identifier.issn2637-6113-
dc.identifier.urihttp://hdl.handle.net/10203/288240-
dc.description.abstractLiquid-metal-based sensors have great opportunities in various applications such as health monitoring, intelligent artificial skin, and soft robotics. However, current liquid-metal-based pressure sensors suffer from low pressure sensitivity, low signal reliability, and poor interconnection properties. This paper introduces a sensitivity-engineerable, reliable liquid-metal-based pressure sensor with a robust interconnection structure for multifunctional wearable applications. Herein, we investigated the effects of dimensions of rigid microbumps on the liquid-metal-based soft pressure sensor. Furthermore, two different types of rigid microbump structures such as embedded bump (E-bump) and anchored bump (A-bump) were designed and integrated with a liquid metal microchannel using multimaterial 3D printing technology, and it enabled the engineering of pressure sensitivity for different purposes. High sensitivity was achieved with E-bump structures, and a robust interconnection structure was realized with A-bump structures. Integration of E-bumps has increased the average sensitivity of the sensor to 0.0727 kPa(-1) (5.43 times higher), and A-bump integration has decreased the average sensitivity to 0.0004 Pa-1 (91.65 times lower) in the range of 0-50 kPa, as compared to the pressure sensor without any microbumps. Therefore, the liquid metal interconnection was established with the A-bump structures for reliable pressure monitoring in practical wearable applications. These characteristics allow the demonstration of the multifunctional wearable electronic applications, including a fingertip pressure sensor glove for wireless multiposition wrist pulse monitoring as traditional East Asian medicine pulse diagnosis and a wireless human-machine interface device.-
dc.languageEnglish-
dc.publisherAMER CHEMICAL SOC-
dc.titleSensitivity-Controllable Liquid-Metal-Based Pressure Sensor for Wearable Applications-
dc.typeArticle-
dc.identifier.wosid000703541500032-
dc.identifier.scopusid2-s2.0-85114388801-
dc.type.rimsART-
dc.citation.volume3-
dc.citation.issue9-
dc.citation.beginningpage4027-
dc.citation.endingpage4036-
dc.citation.publicationnameACS APPLIED ELECTRONIC MATERIALS-
dc.identifier.doi10.1021/acsaelm.1c00546-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPark, Inkyu-
dc.contributor.nonIdAuthorHenriquez, Dionisio Del Orbe-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorliquid metal-
dc.subject.keywordAuthor3D printing-
dc.subject.keywordAuthorwearable sensors-
dc.subject.keywordAuthorhealth monitoring-
dc.subject.keywordAuthorhuman pulse diagnosis-
dc.subject.keywordAuthorhuman-machine interface-
dc.subject.keywordPlusSTRAIN SENSORS-
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