DC Field | Value | Language |
---|---|---|
dc.contributor.author | Gul, Osman | ko |
dc.contributor.author | Kim, Kyuyoung | ko |
dc.contributor.author | Gu, Jimin | ko |
dc.contributor.author | Choi, Jungrak | ko |
dc.contributor.author | Henriquez, Dionisio Del Orbe | ko |
dc.contributor.author | Ahn, Junseong | ko |
dc.contributor.author | Park, Inkyu | ko |
dc.date.accessioned | 2021-10-18T08:10:40Z | - |
dc.date.available | 2021-10-18T08:10:40Z | - |
dc.date.created | 2021-10-18 | - |
dc.date.created | 2021-10-18 | - |
dc.date.created | 2021-10-18 | - |
dc.date.created | 2021-10-18 | - |
dc.date.created | 2021-10-18 | - |
dc.date.created | 2021-10-18 | - |
dc.date.issued | 2021-09 | - |
dc.identifier.citation | ACS APPLIED ELECTRONIC MATERIALS, v.3, no.9, pp.4027 - 4036 | - |
dc.identifier.issn | 2637-6113 | - |
dc.identifier.uri | http://hdl.handle.net/10203/288240 | - |
dc.description.abstract | Liquid-metal-based sensors have great opportunities in various applications such as health monitoring, intelligent artificial skin, and soft robotics. However, current liquid-metal-based pressure sensors suffer from low pressure sensitivity, low signal reliability, and poor interconnection properties. This paper introduces a sensitivity-engineerable, reliable liquid-metal-based pressure sensor with a robust interconnection structure for multifunctional wearable applications. Herein, we investigated the effects of dimensions of rigid microbumps on the liquid-metal-based soft pressure sensor. Furthermore, two different types of rigid microbump structures such as embedded bump (E-bump) and anchored bump (A-bump) were designed and integrated with a liquid metal microchannel using multimaterial 3D printing technology, and it enabled the engineering of pressure sensitivity for different purposes. High sensitivity was achieved with E-bump structures, and a robust interconnection structure was realized with A-bump structures. Integration of E-bumps has increased the average sensitivity of the sensor to 0.0727 kPa(-1) (5.43 times higher), and A-bump integration has decreased the average sensitivity to 0.0004 Pa-1 (91.65 times lower) in the range of 0-50 kPa, as compared to the pressure sensor without any microbumps. Therefore, the liquid metal interconnection was established with the A-bump structures for reliable pressure monitoring in practical wearable applications. These characteristics allow the demonstration of the multifunctional wearable electronic applications, including a fingertip pressure sensor glove for wireless multiposition wrist pulse monitoring as traditional East Asian medicine pulse diagnosis and a wireless human-machine interface device. | - |
dc.language | English | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.title | Sensitivity-Controllable Liquid-Metal-Based Pressure Sensor for Wearable Applications | - |
dc.type | Article | - |
dc.identifier.wosid | 000703541500032 | - |
dc.identifier.scopusid | 2-s2.0-85114388801 | - |
dc.type.rims | ART | - |
dc.citation.volume | 3 | - |
dc.citation.issue | 9 | - |
dc.citation.beginningpage | 4027 | - |
dc.citation.endingpage | 4036 | - |
dc.citation.publicationname | ACS APPLIED ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1021/acsaelm.1c00546 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Park, Inkyu | - |
dc.contributor.nonIdAuthor | Henriquez, Dionisio Del Orbe | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | liquid metal | - |
dc.subject.keywordAuthor | 3D printing | - |
dc.subject.keywordAuthor | wearable sensors | - |
dc.subject.keywordAuthor | health monitoring | - |
dc.subject.keywordAuthor | human pulse diagnosis | - |
dc.subject.keywordAuthor | human-machine interface | - |
dc.subject.keywordPlus | STRAIN SENSORS | - |
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