Indentation-induced cracking behavior of a Cu(In,Ga)Se-2 films on Mo substrate

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dc.contributor.authorYoo, Dayoungko
dc.contributor.authorZhang, Maoko
dc.contributor.authorChoi, Changsoonko
dc.contributor.authorShin, Byunghako
dc.contributor.authorHwang, Yoon-Hwaeko
dc.contributor.authorKim, Yangdoko
dc.contributor.authorLee, Dongyunko
dc.date.accessioned2021-08-09T07:10:04Z-
dc.date.available2021-08-09T07:10:04Z-
dc.date.created2021-08-09-
dc.date.created2021-08-09-
dc.date.created2021-08-09-
dc.date.issued2021-07-
dc.identifier.citationJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.13, pp.1132 - 1138-
dc.identifier.issn2238-7854-
dc.identifier.urihttp://hdl.handle.net/10203/287089-
dc.description.abstractCu(In,Ga)Se-2 (GIGS) light absorption films were synthesized by co-sputtering method on Mo/soda-lime glass, and the mechanical behavior of the films was investigated by nano-indentation. The Young's modulus and hardness of the films were approximately 88.5 +/- 2.2 and 5.89 +/- 0.23 GPa, respectively. The comparison graph of indentation load-displacement curve with the curve based on the theoretical elastic films, while considering the curvature of the indenter tip, revealed that cracks initiated in the GIGS films at approximately 25 mN indentation load. The transmission electron microscopy (TEM) analysis revealed that most of the cracks exhibited intergranular fracture, and the fracture toughness of the films was similar to 0.22 MPa root m, which is greater than the brittleness of soda-lime glass. Both Palmqvist radial and lateral cracks are observed. Results also reveal that the indentation pressure caused grain subdivision (before cracking initiated), and indentation stress may be absorbed by relatively less dense microstructures of the films. (C) 2021 The Authors. Published by Elsevier B.V.-
dc.languageEnglish-
dc.publisherELSEVIER-
dc.titleIndentation-induced cracking behavior of a Cu(In,Ga)Se-2 films on Mo substrate-
dc.typeArticle-
dc.identifier.wosid000677639100013-
dc.type.rimsART-
dc.citation.volume13-
dc.citation.beginningpage1132-
dc.citation.endingpage1138-
dc.citation.publicationnameJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T-
dc.identifier.doi10.1016/j.jmrt.2021.05.059-
dc.contributor.localauthorShin, Byungha-
dc.contributor.nonIdAuthorYoo, Dayoung-
dc.contributor.nonIdAuthorZhang, Mao-
dc.contributor.nonIdAuthorChoi, Changsoon-
dc.contributor.nonIdAuthorHwang, Yoon-Hwae-
dc.contributor.nonIdAuthorKim, Yangdo-
dc.contributor.nonIdAuthorLee, Dongyun-
dc.description.isOpenAccessY-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorCIGS compound-
dc.subject.keywordAuthorBrittle fracture-
dc.subject.keywordAuthorIntergranular fracture-
dc.subject.keywordAuthorNanoindentation-
dc.subject.keywordPlusFRACTURE-TOUGHNESS-
dc.subject.keywordPlusELASTIC-MODULUS-
dc.subject.keywordPlusHARDNESS-
dc.subject.keywordPlusNANOINDENTATION-
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MS-Journal Papers(저널논문)
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