DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hwang, Hong Gu | ko |
dc.contributor.author | Hahn, Jung Seok | ko |
dc.contributor.author | Lee, Haeshin | ko |
dc.contributor.author | Wang, Younseon | ko |
dc.date.accessioned | 2021-07-08T00:10:20Z | - |
dc.date.available | 2021-07-08T00:10:20Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/286504 | - |
dc.description.abstract | The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface. | - |
dc.title | Quinone curable compositions and adhesive compositions comprising same | - |
dc.title.alternative | 퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Lee, Haeshin | - |
dc.contributor.nonIdAuthor | Hwang, Hong Gu | - |
dc.contributor.nonIdAuthor | Hahn, Jung Seok | - |
dc.contributor.nonIdAuthor | Wang, Younseon | - |
dc.contributor.assignee | KAIST, KOLON INDUSTRIES INC | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 16337179 | - |
dc.identifier.patentRegistrationNumber | 11001683 | - |
dc.date.application | 2017-09-27 | - |
dc.date.registration | 2021-05-11 | - |
dc.publisher.country | US | - |
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