DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, Dal-Jin | ko |
dc.contributor.author | Malik, Muhammad-Hassan | ko |
dc.contributor.author | Yan, Pan | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Roshanghias, Ali | ko |
dc.date.accessioned | 2021-03-19T04:30:10Z | - |
dc.date.available | 2021-03-19T04:30:10Z | - |
dc.date.created | 2021-02-03 | - |
dc.date.issued | 2021-01 | - |
dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292 | - |
dc.identifier.issn | 0957-4522 | - |
dc.identifier.uri | http://hdl.handle.net/10203/281699 | - |
dc.description.abstract | In light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnection technology should provide reliable electrical and mechanical properties. Paper and PET are temperature- and pressure-sensitive, and are not compatible with the conventional flip-chip bonding technologies, i.e., soldering and thermo-compression bonding. In this study, the feasibility of implementing Anisotropic Conductive Films (ACF) in hybrid integration was assessed, in which bare silicon dies with the thicknesses of 30 mu m and 730 mu m were bonded to screen-printed paper and PET substrates. As an alternative to direct bare die bonding, the integration of PET- and paper-based interposers to printed substrates was also addressed here. Correspondingly, the long-term reliability of the ACF-bonded samples was assessed via dynamic bend cycling tests. It was shown that ACF provides robust and reliable interconnects on both substrates with a failure cycle of more than 45,000 cycles. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.title | ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics | - |
dc.type | Article | - |
dc.identifier.wosid | 000604333400010 | - |
dc.identifier.scopusid | 2-s2.0-85098529648 | - |
dc.type.rims | ART | - |
dc.citation.volume | 32 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 2283 | - |
dc.citation.endingpage | 2292 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | - |
dc.identifier.doi | 10.1007/s10854-020-04992-2 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Malik, Muhammad-Hassan | - |
dc.contributor.nonIdAuthor | Yan, Pan | - |
dc.contributor.nonIdAuthor | Roshanghias, Ali | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | ANISOTROPIC CONDUCTIVE FILMS | - |
dc.subject.keywordPlus | ANCHORING POLYMER LAYER | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | ADHESIVES | - |
dc.subject.keywordPlus | PACKAGES | - |
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