ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

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dc.contributor.authorYoon, Dal-Jinko
dc.contributor.authorMalik, Muhammad-Hassanko
dc.contributor.authorYan, Panko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorRoshanghias, Aliko
dc.date.accessioned2021-03-19T04:30:10Z-
dc.date.available2021-03-19T04:30:10Z-
dc.date.created2021-02-03-
dc.date.issued2021-01-
dc.identifier.citationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292-
dc.identifier.issn0957-4522-
dc.identifier.urihttp://hdl.handle.net/10203/281699-
dc.description.abstractIn light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnection technology should provide reliable electrical and mechanical properties. Paper and PET are temperature- and pressure-sensitive, and are not compatible with the conventional flip-chip bonding technologies, i.e., soldering and thermo-compression bonding. In this study, the feasibility of implementing Anisotropic Conductive Films (ACF) in hybrid integration was assessed, in which bare silicon dies with the thicknesses of 30 mu m and 730 mu m were bonded to screen-printed paper and PET substrates. As an alternative to direct bare die bonding, the integration of PET- and paper-based interposers to printed substrates was also addressed here. Correspondingly, the long-term reliability of the ACF-bonded samples was assessed via dynamic bend cycling tests. It was shown that ACF provides robust and reliable interconnects on both substrates with a failure cycle of more than 45,000 cycles.-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.titleACF bonding technology for paper- and PET-based disposable flexible hybrid electronics-
dc.typeArticle-
dc.identifier.wosid000604333400010-
dc.identifier.scopusid2-s2.0-85098529648-
dc.type.rimsART-
dc.citation.volume32-
dc.citation.issue2-
dc.citation.beginningpage2283-
dc.citation.endingpage2292-
dc.citation.publicationnameJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS-
dc.identifier.doi10.1007/s10854-020-04992-2-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorMalik, Muhammad-Hassan-
dc.contributor.nonIdAuthorYan, Pan-
dc.contributor.nonIdAuthorRoshanghias, Ali-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordPlusANISOTROPIC CONDUCTIVE FILMS-
dc.subject.keywordPlusANCHORING POLYMER LAYER-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusADHESIVES-
dc.subject.keywordPlusPACKAGES-
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