Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

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dc.contributor.authorLee, Taeminko
dc.contributor.authorLee, sangmokko
dc.contributor.authorKim, Hyojungko
dc.contributor.authorKim, Myeong Geeko
dc.contributor.authorBae, Hyeon-Minko
dc.contributor.authorLee, Hyunjoo Jennyko
dc.date.accessioned2020-12-16T01:50:21Z-
dc.date.available2020-12-16T01:50:21Z-
dc.date.created2020-12-04-
dc.date.issued2020-07-22-
dc.identifier.citation42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society-
dc.identifier.urihttp://hdl.handle.net/10203/278538-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleCalcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society-
dc.identifier.conferencecountryCN-
dc.identifier.conferencelocationVirtual-
dc.contributor.localauthorBae, Hyeon-Min-
dc.contributor.localauthorLee, Hyunjoo Jenny-
dc.contributor.nonIdAuthorLee, Taemin-
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EE-Conference Papers(학술회의논문)
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