DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bae, Hyeon-Min | ko |
dc.contributor.author | Song, Ha Il | ko |
dc.contributor.author | Jin, Huxian | ko |
dc.date.accessioned | 2020-07-13T01:55:31Z | - |
dc.date.available | 2020-07-13T01:55:31Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/275436 | - |
dc.description.abstract | Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver. | - |
dc.title | Board-to-board interconnect apparatus including a microstrip circuit connected by a waveguide, where a bandwidth of a frequency band is adjustable | - |
dc.title.alternative | 마이크로스트립 회로 및 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Bae, Hyeon-Min | - |
dc.contributor.nonIdAuthor | Song, Ha Il | - |
dc.contributor.nonIdAuthor | Jin, Huxian | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 15555396 | - |
dc.identifier.patentRegistrationNumber | 10686241 | - |
dc.date.application | 2015-06-02 | - |
dc.date.registration | 2020-06-16 | - |
dc.publisher.country | US | - |
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