전자기파 신호 전송을 위한 도파관Polymer waveguide that have a dielectric core and a dielectric cladding for high-speed communication

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Assignee
한국과학기술원
Country
CH (Switzerland)
Application Date
2017-03-27
Application Number
106110139
Registration Date
2019-12-01
Registration Number
I678837
URI
http://hdl.handle.net/10203/275210
Appears in Collection
EE-Patent(특허)
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