Encapsulation structure for transparent flexible organic electronic device투명 플렉시블 유기전자소자용 봉지 구조체

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dc.contributor.author최경철ko
dc.contributor.author권정현ko
dc.date.accessioned2020-03-27T02:20:56Z-
dc.date.available2020-03-27T02:20:56Z-
dc.identifier.urihttp://hdl.handle.net/10203/273684-
dc.description.abstractProvided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another-
dc.titleEncapsulation structure for transparent flexible organic electronic device-
dc.title.alternative투명 플렉시블 유기전자소자용 봉지 구조체-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor최경철-
dc.contributor.nonIdAuthor권정현-
dc.contributor.assignee한국과학기술원-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber16101583-
dc.identifier.patentRegistrationNumber10529951-
dc.date.application2018-08-13-
dc.date.registration2020-01-07-
dc.publisher.countryUS-
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EE-Patent(특허)
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