A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

Abstract

Cu pattern-laminated fabric substrates using epoxy-based B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to fabrics. As a result, fabric substrates having minimum Cu line width of $80\mu \text{m}$ were successfully fabricated without any Cu lines displacement and fabric damages. First, the effects of the curing properties of adhesive films on fine-pitch Cu patterning were investigated by Fourier transform infrared (FTIR) spectroscopy and a 90 & x00B0; peel adhesion test. In addition, the morphology of the Cu pattern-laminated fabric substrates was observed depending on the viscosity of epoxy laminating adhesive film. Finally, the effects of film moduli on the dynamic bending fatigue properties were investigated experimentally and theoretically.