DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Park, Chul Soon | - |
dc.contributor.advisor | 박철순 | - |
dc.contributor.author | Son, Hyuk Su | - |
dc.date.accessioned | 2019-08-25T02:45:15Z | - |
dc.date.available | 2019-08-25T02:45:15Z | - |
dc.date.issued | 2018 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=828277&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/265199 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 전기및전자공학부, 2018.8,[x, 79 p. :] | - |
dc.description.abstract | Wireless communication systems have been studied to increase communication speed using a higher order modulation scheme. In addition, the increasing demand for high speed wireless data communications according to consumer requirements has led to extensive research into the millimeter wave (mm-Wave) and the sub-THz bands. In order for a wireless communication system to achieve data rates of 100 Gbps over a few Gbps, it is necessary to use a high-order modulation method and a wideband characteristic in the sub-THz. Therefore, this paper is about CMOS power amplifiers (PAs) design for 100 Gbps chip-to-chip wireless communication system based on sub-THz band. The proposed sub-THz CMOS PA for chip-to-chip wireless communication consists of two types. First, as a CMOS PA for QPSK wireless chip-to-chip communication, a dual-bias configuration is proposed. This improved both linearity and efficiency at the same time. Second, a pole-controlled wideband CMOS PA for 16-QAM 100Gbps chip-to-chip wireless communication is proposed. The fabricated PA has a high gain performance and a wideband characteristics of about 40 GHz at the same time. The proposed PA is suitable for high-speed chip-to-chip wireless communication as a result of analysis based on measurement results and linearity analysis. We also proposed a possible implementation of sub-THz PA using CMOS process. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | chip-to-chip wireless communication▼aCMOS▼apower amplifier (PA)▼acurrent combining▼alinearizer▼awide bandwidth▼atransformer | - |
dc.subject | 칩 간 무선통신▼aCMOS▼asub-THz▼a전력증폭기▼a전류 결합 방식▼a선형화기▼a광대역▼a변압기 | - |
dc.title | 120 GHz CMOS power amplifiers for wireless chip to chip communication | - |
dc.title.alternative | 칩 간 무선 통신용 120 GHz CMOS 전력증폭기 | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :전기및전자공학부, | - |
dc.contributor.alternativeauthor | 손혁수 | - |
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