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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs)

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorChoi, Yongwonko
dc.contributor.authorShin, Jiwonko
dc.date.accessioned2019-04-15T23:32:54Z-
dc.date.available2019-04-15T23:32:54Z-
dc.date.created2013-07-10-
dc.date.issued2013-01-23-
dc.identifier.citation2013 Pan Pacific Microelectronics Symposium-
dc.identifier.urihttp://hdl.handle.net/10203/259110-
dc.languageEnglish-
dc.publisher2013 Pan Pacific Microelectronics Symposium-
dc.title3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs)-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2013 Pan Pacific Microelectronics Symposium-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChoi, Yongwon-
dc.contributor.nonIdAuthorShin, Jiwon-
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MS-Conference Papers(학술회의논문)
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