Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Shin, Ji-Won | ko |
| dc.contributor.author | Choi, Yong-Won | ko |
| dc.contributor.author | Kim, Young Soon | ko |
| dc.contributor.author | Kim, Un Byung | ko |
| dc.contributor.author | Jee, Young Kun | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2019-04-15T21:10:08Z | - |
| dc.date.available | 2019-04-15T21:10:08Z | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.issued | 2013-05-30 | - |
| dc.identifier.citation | The 63rd Electronic Components and Technology Conference, pp.1024 - 1030 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/258321 | - |
| dc.language | English | - |
| dc.publisher | The 63rd Electronic Components and Technology Conference | - |
| dc.title | Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000332764900156 | - |
| dc.identifier.scopusid | 2-s2.0-84883357488 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1024 | - |
| dc.citation.endingpage | 1030 | - |
| dc.citation.publicationname | The 63rd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.doi | 10.1109/ECTC.2013.6575698 | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Shin, Ji-Won | - |
| dc.contributor.nonIdAuthor | Choi, Yong-Won | - |
| dc.contributor.nonIdAuthor | Kim, Young Soon | - |
| dc.contributor.nonIdAuthor | Kim, Un Byung | - |
| dc.contributor.nonIdAuthor | Jee, Young Kun | - |
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