DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chang, Jaewon | ko |
dc.contributor.author | Kang, Sung Kwon | ko |
dc.contributor.author | Lee, Jae-Ho | ko |
dc.contributor.author | Kim, Keun-Soo | ko |
dc.contributor.author | Lee, Hyuck Mo | ko |
dc.date.accessioned | 2019-04-15T18:12:47Z | - |
dc.date.available | 2019-04-15T18:12:47Z | - |
dc.date.created | 2014-01-09 | - |
dc.date.issued | 2013-10-08 | - |
dc.identifier.citation | The 15th International Conference on Electronic Materials and Packaging | - |
dc.identifier.uri | http://hdl.handle.net/10203/257057 | - |
dc.language | English | - |
dc.publisher | The Korean Microelectronics and Packaging Society | - |
dc.title | A Study of Sn Whisker Growth using minor Alloying Addition, and Plastic Deformation | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | The 15th International Conference on Electronic Materials and Packaging | - |
dc.identifier.conferencecountry | KO | - |
dc.contributor.localauthor | Lee, Hyuck Mo | - |
dc.contributor.nonIdAuthor | Chang, Jaewon | - |
dc.contributor.nonIdAuthor | Kang, Sung Kwon | - |
dc.contributor.nonIdAuthor | Lee, Jae-Ho | - |
dc.contributor.nonIdAuthor | Kim, Keun-Soo | - |
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