Printed circuit board and manufacturing method there of인쇄 회로 기판 및 그 제조 방법
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 임성갑 | ko |
| dc.contributor.author | 유재범 | ko |
| dc.contributor.author | 박용진 | ko |
| dc.contributor.author | 고영관 | ko |
| dc.contributor.author | 김신영 | ko |
| dc.date.accessioned | 2019-04-15T17:54:49Z | - |
| dc.date.available | 2019-04-15T17:54:49Z | - |
| dc.date.issued | 2017-12-01 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/256913 | - |
| dc.title | Printed circuit board and manufacturing method there of | - |
| dc.title.alternative | 인쇄 회로 기판 및 그 제조 방법 | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | 임성갑 | - |
| dc.contributor.nonIdAuthor | 유재범 | - |
| dc.contributor.nonIdAuthor | 박용진 | - |
| dc.contributor.nonIdAuthor | 고영관 | - |
| dc.contributor.nonIdAuthor | 김신영 | - |
| dc.contributor.assignee | KAIST, SAMSUNG ELECTRO MECH | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 2014-146679 | - |
| dc.identifier.patentRegistrationNumber | 6250489 | - |
| dc.date.application | 2014-07-17 | - |
| dc.date.registration | 2017-12-01 | - |
| dc.publisher.country | JA | - |
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