Dynamic Thermal Management in Mobile Devices Considering the Thermal Coupling between Battery and Application Processor
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Xie, Q | ko |
| dc.contributor.author | Kim, JM | ko |
| dc.contributor.author | Wang, Y | ko |
| dc.contributor.author | Shin, DH | ko |
| dc.contributor.author | 장래혁 | ko |
| dc.contributor.author | Pedram, M | ko |
| dc.date.accessioned | 2019-04-15T16:51:55Z | - |
| dc.date.available | 2019-04-15T16:51:55Z | - |
| dc.date.created | 2014-07-08 | - |
| dc.date.created | 2014-07-08 | - |
| dc.date.created | 2014-07-08 | - |
| dc.date.issued | 2013-11-18 | - |
| dc.identifier.citation | IEEE/ACM International Conference on Computer-Aided Design (ICCAD) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/256209 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Dynamic Thermal Management in Mobile Devices Considering the Thermal Coupling between Battery and Application Processor | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE/ACM International Conference on Computer-Aided Design (ICCAD) | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | 장래혁 | - |
| dc.contributor.nonIdAuthor | Xie, Q | - |
| dc.contributor.nonIdAuthor | Kim, JM | - |
| dc.contributor.nonIdAuthor | Wang, Y | - |
| dc.contributor.nonIdAuthor | Shin, DH | - |
| dc.contributor.nonIdAuthor | Pedram, M | - |
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