DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bae, Hyeon-Min | ko |
dc.contributor.author | SONG, Ha II | ko |
dc.contributor.author | JIN, HuXian | ko |
dc.contributor.author | LEE, Joon Yeong | ko |
dc.contributor.author | WON, Hyo Sup | ko |
dc.contributor.author | YOON, Tae Hoon | ko |
dc.date.accessioned | 2019-04-15T15:17:12Z | - |
dc.date.available | 2019-04-15T15:17:12Z | - |
dc.date.issued | 2018-11-13 | - |
dc.identifier.uri | http://hdl.handle.net/10203/254893 | - |
dc.description.abstract | The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide. | - |
dc.title | MICROSTRIP CIRCUIT AND APPARATUS FOR CHIP-TO-CHIP INTERFACE COMPRISING THE SAME | - |
dc.title.alternative | 마이크로스트립 회로 및 이를 포함하는 칩-대-칩 인터페이스 장치 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Bae, Hyeon-Min | - |
dc.contributor.nonIdAuthor | SONG, Ha II | - |
dc.contributor.nonIdAuthor | JIN, HuXian | - |
dc.contributor.nonIdAuthor | LEE, Joon Yeong | - |
dc.contributor.nonIdAuthor | YOON, Tae Hoon | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 15342551 | - |
dc.identifier.patentRegistrationNumber | 10,128,557 | - |
dc.date.application | 2016-11-03 | - |
dc.date.registration | 2018-11-13 | - |
dc.publisher.country | US | - |
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