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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 | |
| RF interconnect for multi-Gbit/s board-level clock distribution Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08 |
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