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Showing results 1 to 2 of 2

1
A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component

Lee, Sanguk; Kim, Hyunwoong; Ahn, Jangyong; Rhee, Jaewon; Cho, Jaeyong; Kim, Hongseok; Ahn, Seungyoung, IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, v.73, 2024

2
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory

Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; et al, MICROMACHINES, v.13, no.7, 2022-07

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