Showing results 1 to 5 of 5
A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component Lee, Sanguk; Kim, Hyunwoong; Ahn, Jangyong; Rhee, Jaewon; Cho, Jaeyong; Kim, Hongseok; Ahn, Seungyoung, IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, v.73, 2024 |
Minimizing Leakage Magnetic Field of Wireless Power Transfer Systems Using Phase Difference Control Woo, Seongho; Shin, Yujun; Lee, Changmin; Rhee, Jaewon; Ahn, Jangyong; Moon, Jungick; Son, Seokhyeon; et al, ENERGIES, v.15, no.21, 2022-11 |
Shielding Sensor Coil to Reduce the Leakage Magnetic Field and Detect the Receiver Position in Wireless Power Transfer System for Electric Vehicle Son, Seokhyeon; Woo, Seongho; Kim, Haerim; Ahn, Jangyong; Huh, Sungryul; Lee, Sanguk; Ahn, Seungyoung, ENERGIES, v.15, no.7, 2022-04 |
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12 |
Stepped-Frequency Binary Offset Carrier Modulation for Global Navigation Satellite Systems Kong, Seung-Hyun; Cho, Sangjae; Kim, Taeseon; Lee, Sanguk, IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, v.59, no.3, pp.2733 - 2751, 2023-06 |
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