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Browse "GT-Journal Papers(저널논문)" by Author Kim, Joungho

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Showing results 1 to 16 of 16

1	A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application Hong, Seokwoo; Kim, Youngwoo; Lee, Seongsoo; Jeong, Seungtaek; Sim, Boogyo; Kim, Hongseok; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.2031 - 2039, 2019-12
2	Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage Kim, Hongseok; Song, Chiuk; Jung, Daniel Hyunsuk; Kim, DongHyun; Kim, In Myoung; Kim, Young Il; Kim, Jong Hoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.383 - 400, 2016-02
3	Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System Kim, Ji Seong; Kim, Jong Hoon; Kong, Sunkyu; Kim, Hongseok; Suh, In-Soo; Suh, Nam Pyo; Cho, Dong-Ho; et al, PROCEEDINGS OF THE IEEE, v.101, no.6, pp.1332 - 1342, 2013-06
4	Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System Chun, Yangbae; Park, Seongwook; Kim, Jong Hoon; Kim, Ji Seong; Kim, Hongseok; Kim, Joungho; Kim, Nam; et al, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E97B, no.2, pp.416 - 423, 2014-02
5	EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09
6	High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07
7	High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09
8	Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging Song, Chiuk; Kim, Hongseok; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kong, Sunkyu; Kim, Jiseong; Ahn, Seungyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.4, pp.1194 - 1206, 2016-08
9	Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06
10	Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement Lee, Jungho; Ahn, Seungyoung; Kwon, Woon-Seong; Paik, Kyung-Wook; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09
11	Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12
12	MINI-SPECIAL ISSUE ON 2014 IEEE WIRELESS POWER TRANSFER CONFERENCE (WPTC 2014) Kim, Joungho; Ahn, Seungyoung, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.778 - 779, 2015-03
13	Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02
14	RF interconnect for multi-Gbit/s board-level clock distribution Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08
15	Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel Shin, Min-Chul; Kim, Myunghoi; Kim, Ji-Seong; Kim, Joungho; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.1, pp.94 - 99, 2014-01
16	Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

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