Park, Hyunchul; Oh, Taeho; Kim, Inhi, Accident Analysis and Prevention, v.205, 2024-09
Tamakloe, Reuben; Zhang, Kaihan; Kim, Inhi, Accident Analysis and Prevention, v.205, 2024-09
Zhang, Ziqian; Li, Haojie; Hu, Haodong; Chen, Tiantian; Ren, Gang, Travel Behaviour and Society, v.36, 2024-07
Phi, Francis G.; Cho, Bumsu; Kim, Jungeun; Cho, Hyungik; Choo, Yun Wook; Kim, Dookie; Kim, Inhi, Geomechanics and Engineering, v.37, no.6, pp.539 - 554, 2024-06
Gu, Tianqi; Xu, Weiping; Shi, Peijie; Wang, Ruiyi; Kim, Inhi, Multimodal Transportation, v.3, no.2, 2024-06
Jung, Jaeeun; Kim, Inhi; Yoon, Jinwon, International Journal of Sustainable Transportation, 2024-06
Jeong, Hyeonjun; Shin, Juyeb; Rameau, Francois; Kum, Dongsuk, IEEE ROBOTICS AND AUTOMATION LETTERS, v.9, no.5, pp.4710 - 4717, 2024-05
Tamakloe, Reuben; Zhang, Kaihan; Hossain, Ahmed; Kim, Inhi; Park, Shin Hyoung, Accident Analysis and Prevention, v.199, 2024-05
Lee, Yoon Koo; Sung, Chaeeun; Kim, Jiyeon; Hong, Chaemin; Choi, Jinnil, JOURNAL OF ENERGY STORAGE, v.82, 2024-03
Shin, Jeu; Lee, Yoon Koo, JOURNAL OF POWER SOURCES, v.595, 2024-03
A new single-stage PFC AC/DC converter with low link-capacitor voltage Lee, Byoung-Hee; Kim, Chong-Eun; Park, Ki-Bum; Moon, Gun-Woo, JOURNAL OF POWER ELECTRONICS, v.7, pp.328 - 335, 2007-10 |
Voltage oscillation reduction technique for phase-shift full-bridge converter Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung Joong, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.54, no.5, pp.2779 - 2790, 2007-10 |
A Double-Ended ZVS Half-Bridge Zeta Converter Park, Ki Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.23, pp.2838 - 2846, 2008-11 |
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement Lee, Jungho; Ahn, Seungyoung; Kwon, Woon-Seong; Paik, Kyung-Wook; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09 |
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
RF interconnect for multi-Gbit/s board-level clock distribution Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08 |
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02 |
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