DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Yong-Won | ko |
dc.contributor.author | Shin, Ji-Won | ko |
dc.contributor.author | Kim, Young Soon | ko |
dc.contributor.author | Suk, Kyung-lim | ko |
dc.contributor.author | Kim, Il | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2019-04-15T15:14:30Z | - |
dc.date.available | 2019-04-15T15:14:30Z | - |
dc.date.created | 2014-07-25 | - |
dc.date.created | 2014-07-25 | - |
dc.date.issued | 2014-05-28 | - |
dc.identifier.citation | The 64th Electronic Components and Technology Conference | - |
dc.identifier.uri | http://hdl.handle.net/10203/254829 | - |
dc.language | English | - |
dc.publisher | The 64th Electronic Components and Technology Conference | - |
dc.title | A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-84907904003 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | The 64th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Choi, Yong-Won | - |
dc.contributor.nonIdAuthor | Shin, Ji-Won | - |
dc.contributor.nonIdAuthor | Kim, Young Soon | - |
dc.contributor.nonIdAuthor | Suk, Kyung-lim | - |
dc.contributor.nonIdAuthor | Kim, Il | - |
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