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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The Effects of Self-Fluxing Additives in Solder Anisotropic Conductive Films (ACFs)　on Solder Wettability and Joint Reliability of Flex-On-Board (FOB) Assemblies

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dc.contributor.authorKim, Seung-Hoko
dc.contributor.authorChoi, Yong-Wonko
dc.contributor.authorKim, Yoo-Sunko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2019-04-15T15:13:47Z-
dc.date.available2019-04-15T15:13:47Z-
dc.date.created2014-07-25-
dc.date.created2014-07-25-
dc.date.issued2014-05-31-
dc.identifier.citationThe 64th Electronic Components and Technology Conference-
dc.identifier.urihttp://hdl.handle.net/10203/254808-
dc.languageEnglish-
dc.publisherThe 64th Electronic Components and Technology Conference-
dc.titleThe Effects of Self-Fluxing Additives in Solder Anisotropic Conductive Films (ACFs)　on Solder Wettability and Joint Reliability of Flex-On-Board (FOB) Assemblies-
dc.typeConference-
dc.identifier.scopusid2-s2.0-84907897309-
dc.type.rimsCONF-
dc.citation.publicationnameThe 64th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKim, Seung-Ho-
dc.contributor.nonIdAuthorChoi, Yong-Won-
dc.contributor.nonIdAuthorKim, Yoo-Sun-
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MS-Conference Papers(학술회의논문)
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