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Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seungyoung; Ryu, Woonghwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woopoung; Paik, Kyung-Wook; et al, Electronics Manufacturing Technology Symposium, IEEE, 1999-10-18

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