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Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link

Lee, Seonghi; Kim, Hyun Woong; Park, Jiyoung; Lee, Youngho; Moon, Sungwook; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.147 - 152, Institute of Electrical and Electronics Engineers Inc., 2023-08-02

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