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Browse "EE-Theses_Ph.D.(박사논문) " by Subject 2.5D/3D IC▼adefect detection▼adefect localization▼aredundancy configuration▼aself-repair▼athrough silicon via

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(A) non-invasive defect detection and localization method, and a self-repair redundancy configuration for improved reliability of through silicon via (TSV) based 2.5D/3D IC = 관통 실리콘 비아 기반 2.5/3차원 집적회로의 신뢰성 향상을 위한 비침습 결함 검출 및 위치 추적 방법과 자체 복구 중복구성link

Jung, Daniel Hyunsuk; Kim, Joungho; et al, 한국과학기술원, 2019

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