DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Chang-Gyu | ko |
dc.contributor.author | Lee, Won-Jong | ko |
dc.date.accessioned | 2011-08-29T05:38:18Z | - |
dc.date.available | 2011-08-29T05:38:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-10 | - |
dc.identifier.citation | THIN SOLID FILMS, v.519, no.1, pp.74 - 80 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://hdl.handle.net/10203/25000 | - |
dc.description.abstract | We developed an angular distribution function that describes the distribution of directional sputter-depositing atoms: g(theta) = (k sin(2) theta + k(-1) cos(2) theta)(-2), where k is a directionality factor that determines the directionality of depositing atoms and theta is the incident angle of a depositing atom. The thickness profiles of the sputtered films deposited inside a vertical trench were simulated using the ballistic transport reaction model in conjunction with the angular distribution function, g(theta). The simulated thickness profile agreed well with the experimentally measured thickness profile. General equations that describe the thickness profile of sputter-deposited films inside vias and trenches were derived. The initial film thickness profile could be predicted by substituting the directionality factor, k, and the geometric parameters of the via or trench in the general equations. An optimum directionality factor, defined as the directionality factor that maximizes the sidewall coverage of a vertical pattern, was obtained by solving the general equations. An ideally-tapered via that maximizes sidewall coverage was identified by optimizing the directionality factors and aspect ratios of the vias. (C) 2010 Elsevier B.V. All rights reserved. | - |
dc.description.sponsorship | This work was supported by the new growth engine semiconductor project of the Ministry of Knowledge and Economy (Grant No.10029009) and Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (Grant No. 2010-0000862). | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | Elsevier Science Sa | - |
dc.subject | FREE MOLECULAR-TRANSPORT | - |
dc.subject | STEP COVERAGE | - |
dc.subject | 3-DIMENSIONAL INTEGRATION | - |
dc.subject | SIMULATION | - |
dc.subject | COPPER | - |
dc.subject | VIAS | - |
dc.title | An angular distribution function for the sputter-depositing atoms and general equations describing the initial thickness profile of a thin film deposited inside a via and trench by sputtering | - |
dc.type | Article | - |
dc.identifier.wosid | 000283955200013 | - |
dc.identifier.scopusid | 2-s2.0-77957719398 | - |
dc.type.rims | ART | - |
dc.citation.volume | 519 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 74 | - |
dc.citation.endingpage | 80 | - |
dc.citation.publicationname | THIN SOLID FILMS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Won-Jong | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Angular distribution function | - |
dc.subject.keywordAuthor | Equation | - |
dc.subject.keywordAuthor | Thickness profile | - |
dc.subject.keywordAuthor | Sidewall coverage | - |
dc.subject.keywordAuthor | Directionality factor | - |
dc.subject.keywordAuthor | Tapered via | - |
dc.subject.keywordPlus | FREE MOLECULAR-TRANSPORT | - |
dc.subject.keywordPlus | STEP COVERAGE | - |
dc.subject.keywordPlus | 3-DIMENSIONAL INTEGRATION | - |
dc.subject.keywordPlus | SIMULATION | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | VIAS | - |
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