DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Kim, Hyesoo | ko |
dc.contributor.author | Park, Shinyoung | ko |
dc.contributor.author | Kim, Jonghoon | ko |
dc.contributor.author | Park, Jung-Min | ko |
dc.contributor.author | Kim, UnHo | ko |
dc.contributor.author | Jeon, YuckHwan | ko |
dc.date.accessioned | 2019-01-22T08:15:39Z | - |
dc.date.available | 2019-01-22T08:15:39Z | - |
dc.date.created | 2018-12-26 | - |
dc.date.created | 2018-12-26 | - |
dc.date.created | 2018-12-26 | - |
dc.date.issued | 2017-12-15 | - |
dc.identifier.citation | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) | - |
dc.identifier.uri | http://hdl.handle.net/10203/248944 | - |
dc.language | English | - |
dc.publisher | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) | - |
dc.title | Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig | - |
dc.type | Conference | - |
dc.identifier.wosid | 000428157200128 | - |
dc.identifier.scopusid | 2-s2.0-85050478429 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) | - |
dc.identifier.conferencecountry | CC | - |
dc.identifier.conferencelocation | Hangzhou, China | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Hyesoo | - |
dc.contributor.nonIdAuthor | Park, Shinyoung | - |
dc.contributor.nonIdAuthor | Kim, Jonghoon | - |
dc.contributor.nonIdAuthor | Park, Jung-Min | - |
dc.contributor.nonIdAuthor | Kim, UnHo | - |
dc.contributor.nonIdAuthor | Jeon, YuckHwan | - |
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