Stress‐minimized and Robust Thin Film Encapsulation based on Mechanically Improved Nanolaminate and Organic Layers
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kwon, Jeong Hyun | ko |
| dc.contributor.author | Jeon, Yongmin | ko |
| dc.contributor.author | Choi, Kyung Cheol | ko |
| dc.date.accessioned | 2019-01-22T08:15:03Z | - |
| dc.date.available | 2019-01-22T08:15:03Z | - |
| dc.date.created | 2018-12-21 | - |
| dc.date.created | 2018-12-21 | - |
| dc.date.issued | 2018-05 | - |
| dc.identifier.citation | Society for Information Display 2018 International Symposium, SID 2018 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/248931 | - |
| dc.language | English | - |
| dc.publisher | Society for Information Display | - |
| dc.title | Stress‐minimized and Robust Thin Film Encapsulation based on Mechanically Improved Nanolaminate and Organic Layers | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Society for Information Display 2018 International Symposium, SID 2018 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Los Angeles Convention Center | - |
| dc.contributor.localauthor | Choi, Kyung Cheol | - |
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.