DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jae Hwan | ko |
dc.contributor.author | Park, Hongkeun | ko |
dc.contributor.author | Pak, Kwanyong | ko |
dc.contributor.author | Yoon, Alexander | ko |
dc.contributor.author | Kim, Yun Sang | ko |
dc.contributor.author | Im, Sung Gap | ko |
dc.contributor.author | Hwang, Wan Sik | ko |
dc.contributor.author | Cho, Byung-Jin | ko |
dc.date.accessioned | 2018-12-20T05:20:28Z | - |
dc.date.available | 2018-12-20T05:20:28Z | - |
dc.date.created | 2018-12-12 | - |
dc.date.created | 2018-12-12 | - |
dc.date.created | 2018-12-12 | - |
dc.date.created | 2018-12-12 | - |
dc.date.created | 2018-12-12 | - |
dc.date.created | 2018-12-12 | - |
dc.date.issued | 2018-12-04 | - |
dc.identifier.citation | 64th IEEE International Electron Devices Meeting (IEDM 2018) | - |
dc.identifier.uri | http://hdl.handle.net/10203/247708 | - |
dc.description.abstract | For the first time, a novel doping technique using an initiated CVD (iCVD) process was developed, facilitating the conformal, wafer-scale and controlled nanoscale doping of semiconductors at a high concentration. iCVD poly(boron allyloxide) (pBAO) and poly(triallyl phosphate) (pTAP) were used as a p-type and n-type dopant diffusion source, respectively. In detail, an optimized integration process was developed involving copolymer p(BAO-co-V3D3) passivation for pBAO and double-step deposition for pTAP. It was found that a dopant-containing polymer layer with a sub-10-nm thickness provided a high doping concentration at a shallow junction depth (10 nm) for both the p-type (10(20) cm(-3)) and the n-type (10(21) cm(-3)). Furthermore, the conformality and dopant distribution of the iCVD polymer layer were investigated using a high-aspect-ratio Si fin (5:1). The SOI nFET with iCVD doping at the source/drain regions exhibited better subthreshold swing and on-current values than a SOI nFET with conventional ion-implantation doping. Compared to other diffusion doping methods, the iCVD process could achieve lower sheet resistance. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Conformal, Wafer-Scale and Controlled Nanoscale Doping of Semiconductors Via the iCVD Process | - |
dc.type | Conference | - |
dc.identifier.wosid | 000459882300016 | - |
dc.identifier.scopusid | 2-s2.0-85061814135 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 64th IEEE International Electron Devices Meeting (IEDM 2018) | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Hilton San Francisco Union Square | - |
dc.identifier.doi | 10.1109/IEDM.2018.8614494 | - |
dc.contributor.localauthor | Im, Sung Gap | - |
dc.contributor.localauthor | Cho, Byung-Jin | - |
dc.contributor.nonIdAuthor | Yoon, Alexander | - |
dc.contributor.nonIdAuthor | Kim, Yun Sang | - |
dc.contributor.nonIdAuthor | Hwang, Wan Sik | - |
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