DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeong, Giuk | ko |
dc.contributor.author | Jaung, Yoon Hwan | ko |
dc.contributor.author | Kim, Jekyung | ko |
dc.contributor.author | Song, Jae Yong | ko |
dc.contributor.author | Shin, Byungha | ko |
dc.date.accessioned | 2018-12-20T01:48:00Z | - |
dc.date.available | 2018-12-20T01:48:00Z | - |
dc.date.created | 2018-11-26 | - |
dc.date.created | 2018-11-26 | - |
dc.date.created | 2018-11-26 | - |
dc.date.issued | 2018-10 | - |
dc.identifier.citation | JOURNAL OF MATERIALS CHEMISTRY C, v.6, no.37, pp.10083 - 10087 | - |
dc.identifier.issn | 2050-7526 | - |
dc.identifier.uri | http://hdl.handle.net/10203/247133 | - |
dc.description.abstract | Tin selenide (Sn1-xSe) polycrystalline thin films were prepared by thermal co-evaporation, and the thermoelectric properties of the Sn1-xSe thin films were investigated. We found that a stoichiometric SnSe thin film has a lower thermal conductivity than the bulk form of SnSe reported in the literature. As the composition deviated from the stoichiometry (i.e., x > 0), interesting changes in thermal conductivity were observed: a general trend of increasing thermal conductivity with increasing x except that the lowest thermal conductivity was observed when x similar to 0.3. Two factors are identified to influence the dependence of thermal conductivity on the composition: a portion of the SnSe2 phase that has a higher thermal conductivity than SnSe and the density of the SnSe/SnSe2 interface, which is expected to be effective in phonon scattering because of a higher Kapitza resistance. An interplay between these two factors leads to the minimum thermal conductivity at x similar to 0.3. Our study provides new strategies that can potentially lead to the improved thermoelectric performance of SnSe: use of thin films and careful control of the composition. | - |
dc.language | English | - |
dc.publisher | ROYAL SOC CHEMISTRY | - |
dc.title | Sn1-xSe thin films with low thermal conductivity: role of stoichiometric deviation in thermal transport | - |
dc.type | Article | - |
dc.identifier.wosid | 000449750600028 | - |
dc.identifier.scopusid | 2-s2.0-85054139152 | - |
dc.type.rims | ART | - |
dc.citation.volume | 6 | - |
dc.citation.issue | 37 | - |
dc.citation.beginningpage | 10083 | - |
dc.citation.endingpage | 10087 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS CHEMISTRY C | - |
dc.identifier.doi | 10.1039/c8tc03051k | - |
dc.contributor.localauthor | Shin, Byungha | - |
dc.contributor.nonIdAuthor | Jaung, Yoon Hwan | - |
dc.contributor.nonIdAuthor | Song, Jae Yong | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | ENHANCED THERMOELECTRIC PERFORMANCE | - |
dc.subject.keywordPlus | POLYCRYSTALLINE SNSE | - |
dc.subject.keywordPlus | FIGURE | - |
dc.subject.keywordPlus | MERIT | - |
dc.subject.keywordPlus | CRYSTALS | - |
dc.subject.keywordPlus | IMPACT | - |
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