Fabrication of thin film encapsulation for organic electronic devices via initiated chemical vapor deposition (iCVD)

Abstract

With the increasing demand for future electronic devices, organic electronics such as organic light-emitting diodes is emerging owing to its unique advantages such as flexibility, thinness, and light weight. However, organic electronics degrade rapidly upon exposure to water vapor and oxygen in ambient condition. In this thesis, thin film encapsulation that protects the organic electronics from penetration of water vapor and oxygen are investigated. Initiated chemical vapor deposition was adopted along with atomic layer deposition process to fabricate the thin film encapsulation composed of organic/inorganic multilayer. The thin film encapsulation was applied to various organic electronics to confirm the increase in stability and elongation of device life time.